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2023 Symposium on High Power Semiconductor Materials ( GaN & SiC ) and Devices

As the problem of climate change becomes increasingly severe, the transition to net-zero carbon emissions has become an international consensus among governments and businesses worldwide. Therefore, compound semiconductors such as Silicon Carbide (SiC) and Gallium Nitride (GaN) have seen explosive growth in demand due to their potential applications in various end products. These key materials can be used in electric vehicles, 5G/6G communication, fast charging, and more, making them essential for national strategic development in many countries. Power semiconductor materials and components with wide band gap (WBG) characteristics have become a crucial platform for power electronics products and applications.

The High-Power Device Application Research Alliance was established in 2015 by the National Sun Yat-sen University and the Taiwan Institute of Economic Research to conduct semiconductor industry technology research and development projects, focusing on power semiconductor material technology development and industry promotion. This initiative aims to inject new energy into the industry. This year, the High-Power Device Application Research Alliance, in collaboration with the National Sun Yat-sen University and the Taiwan Institute of Economic Research, invites international and domestic experts in power semiconductors to share their knowledge and engage in discussions with academia, industry, and research communities. Additionally, they are organizing a student thesis poster competition, hoping that this forum will promote collaboration among academia, industry, and research communities, stimulate research and development in the field of power semiconductor materials and high-power modules, and accelerate the research and development layout of domestic power electronics and related industries.

Therefore, we sincerely invite you to participate in this event and take the opportunity to exchange experiences with advanced professionals in the domestic and international industries. We hope to foster collaborative alliances in research and development throughout the supply chain, establishing a strong presence in Taiwan and expanding globally!

  2023年11月10日 (五) 10:00-16:10(09:30-10:00報到) /

  November 10th , 2023, Fri., 10:00-16:10 ( 09:30-10:00 for registration )

  • 論壇地點 / Symposium Venue:

 臺大醫院國際會議中心 301會議室(台北市中正區徐州路2號) /

 Room 301, NTUH International Convention Center ( No. 2, Xuzhou Road, Zhongzheng District, Taipei City )

  • 論壇報名時間 / Registration Period:

 即日起至2023年11月3日(五)下午5:00止(名額有限,以額滿為止) /

 From now until Nov. 3rd, 2023, Friday, 5:00p.m., until Full

  • 線上報名網址 / Registration Website:

 https://forms.gle/EdnDgt7Gy6hEYieK9

  • 主辦單位 / Organized Institutions:

 高功率元件應用研發聯盟 / High Power Device Application And Research Alliance

  • 協辦單位 / Co-Organized Institutions:

 國家中山科學研究院 / National Chung-Shan Institute of Science & Technology (NCSIST)

 台灣經濟研究院 / Taiwan Institute of Economic Research (TIER)

  • 會議連絡人 / Contact:

台灣經濟研究院 Taiwan Institute of Economic Research

台北市德惠街16-8號7樓(7F., No. 16-8, Dehuei St., Jhongshan District, Taipei City 10461, Taiwan)

鄧祥寧Ning Teng

(02)2586-5000 ext.810

d33899@tier.org.tw

黃威菁Lana Huang

(02)2586-5000 ext.875

d33581@tier.org.tw

  • 交通方式/Transportation:

    臺大醫院國際會議中心 301會議室(台北市中正區徐州路2號)

   交通資訊連結:http://www.nthcc.com.tw/traffic/traffic01 

 

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